DL90-ST0
DLC Rack - 22U 14.5kW
- Supports up to 14U EIA servers
- Liquid-to-Air CDU
- Up to 14.5kW of cooling capacity
- Supports 1+1 redundant total power up to 17.3 kVA
SPECIFICATIONS
Hardware Capacity
14U
Heat Dissipation Capacity
14.5kW at approach temperature 25°C
Dimensions (L x W x H)
1200 x 800 x 1115 mm
Weight
Total weight: 215 kg
Rack: 103 kg
PDU: 6 kg *2pcs
CDU: 80 kg
Manifold: 20 kg
Rack: 103 kg
PDU: 6 kg *2pcs
CDU: 80 kg
Manifold: 20 kg
CDU Power Consumption
Full load: 2000W
Electrical Connection
PDU: IEC 60309 30A-3P+N+E, 6H, Plug x2
CDU: IEC 60320 C19, Plug x2
CDU: IEC 60320 C19, Plug x2
Water Flow Rate
7 - 30 LPM
Part Numbers
- POC DLC Rack: 6NDL90ST0MR-000-1*
- PDU: 25CRH-1K8000-C0R
- CDU: 25ST7-4000ZA-D0R
- CDU rail kit: 25ST7-4000ZL-D0R
- Manifold: 25ST7-4000ZD-J2R
- PDU: 25CRH-1K8000-C0R
- CDU: 25ST7-4000ZA-D0R
- CDU rail kit: 25ST7-4000ZL-D0R
- Manifold: 25ST7-4000ZD-J2R
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
RESOURCES
Articles
Solutions
Tech Guide | August 01, 2024
How to Get Your Data Center Ready for AI? Part One: Advanced Cooling
The proliferation of artificial intelligence has led to the broader adoption of innovative technology, such as advanced cooling and cluster computing, in data centers around the world. Specifically, the rollout of powerful AI processors with ever higher TDPs has made it all but mandatory for data centers to upgrade or even retrofit their infrastructure to utilize more energy-efficient and cost-effective cooling. In part one of GIGABYTE Technology’s latest Tech Guide, we explore the industry’s most advanced cooling solutions so you can evaluate whether your data center can leverage them to get ready for the era of AI.
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