H263-S67-AAW1

High Density Server - 5th/4th Gen Intel^® Xeon^® Scalable - 2U 4-Node DP 8-Bay Gen5 NVMe/SATA/SAS-4 3000W

# HPC # HCI

2U 4-node rear access server system
Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors per node
Dual Intel^® Xeon^® CPU Max Series per node
8-Channel DDR5 RDIMM, 64 x DIMMs
Dual ROM Architecture
1 x CMC port
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays
4 x M.2 slots with PCIe Gen4 x4 interface (optional)
4 x LP PCIe Gen5 x16 slots
4 x OCP 3.0 Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

Get a Quote

Vergleichsliste

Get a Quote

* Das vorliegende Material dient nur zur Referenz. GIGABYTE behalt sich das Recht vor, ohne Vorwarnung Inhalte zu verandern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers fur die Nutzung des Systems reserviert und daher kann die aktuelle Speichergrose von der Speicherangabe abweichen.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

Motherboard

MS63-HD1

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Dual processor per node, TDP up to 270W

Supports TDP up to 350W with no support on OCP slot at ambient 35°C.

Supports TDP up to 350W at ambient 30°C.

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 4677

Total:
8 x LGA 4677

Socket E

Chipset

Intel^® C741

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel^® Xeon^®: Up to 5600 MT/s
4th Gen Intel^® Xeon^®: Up to 4800 MT/s
Intel^® Xeon^® Max Series: Up to 4800 MT/s

LAN

Per node:
1 x 10/100/1000 Mbps Management LAN

Total:
4 x 10/100/1000 Mbps Management LAN
*1 x CMC port

*Please refer to optional parts for ring topology support.

Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
2 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1

Total:
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays, from CPU_1

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel^® SATA RAID 0/1/10/5

Expansion Slots

Per node:
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

Optional 1 x M.2 slot (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards

Total:
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function

Optional 4 x M.2 slots (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2280/22110 cards

Internal I/O

Per node:
1 x TPM header
1 x VROC connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system.

Rear I/O

Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED

Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port

*Only one CMC port per system.

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H263-S67-AAW1
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH263S67DR000ABW1*
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453200-A0R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power supply: 25EP0-230009-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S67SR-RMA-A100

* Das vorliegende Material dient nur zur Referenz. GIGABYTE behält sich das Recht vor, ohne Vorwarnung Inhalte zu verändern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers für die Nutzung des Systems reserviert und daher kann die aktuelle Speichergröße von der Speicherangabe abweichen.

SUPPORT

Downloads

Treiber
BIOS
Utility
Firmware

Handbuch
Kompatibilitätsliste

Online Support

Treiber

BIOS

Utility

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Version

Größe

Datum

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

H263-S67-AAW1

SPECIFICATIONS

SUPPORT

RESOURCES

H263-S67-AAW1