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H261-NO0
High Density Server - 1st/2nd Gen Intel® Xeon® Scalable - 2U 4-Node DP 24-Bay Gen3 NVMe/SATA/SAS
- 2U 4-node with rear access server system
- 1st/2nd Gen Intel® Xeon® Scalable Processors
- Dual processor per node, LGA 3647
- Intel® C621 Chipset
- 6-Channel RDIMM/LRDIMM DDR4, 64 x DIMMs
- Supports Intel® Optane™ DC Persistent Memory
- 4 x Dedicated management ports
- 1 x CMC port
- 24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
- 4 x LP PCIe Gen3 x16 slots
- 4 x LP PCIe Gen3 x8 slots
- 4 x OCP Gen3 x16 mezzanine slots
- Dual 2200W 80 PLUS Platinum redundant power supply
- Optimized performance with Mellanox Infiniband products
* Veškeré zde uvedené materiály jsou pouze orientační. GIGABYTE si vyhrazuje právo kdykoliv měnit nebo revidovat obsah a to bez předchozího upozornění.
* Zmiňovaný výkon je založený na maximálních teoretických hodnotách z rozhraní jednotlivých čipsetů dodavatelů nebo organizace, která definovala specifikaci jednotlivých rozhraní. Skutečný výkon se může lišit v závislosti na konfiguraci systému.
* Všechny ochranné známky a loga jsou vlastnictvím jejich příslušných vlastníků.
* Díky standardní architektuře PC je určité množství paměti vyhrazeno pro systém, proto může být skutečná velikost dostupné paměti nižší než uvedené množství.
* Zmiňovaný výkon je založený na maximálních teoretických hodnotách z rozhraní jednotlivých čipsetů dodavatelů nebo organizace, která definovala specifikaci jednotlivých rozhraní. Skutečný výkon se může lišit v závislosti na konfiguraci systému.
* Všechny ochranné známky a loga jsou vlastnictvím jejich příslušných vlastníků.
* Díky standardní architektuře PC je určité množství paměti vyhrazeno pro systém, proto může být skutečná velikost dostupné paměti nižší než uvedené množství.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87 x 840
440 x 87 x 840
Motherboard
MH61-HD6
CPU
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Dual processor per node
Supports TDP 165W at ambient 35°C
Supports TDP 205W at ambient 30°C
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Note: This device does not support Intel Omni-Path function.
Intel® Xeon® Scalable Processors
Dual processor per node
Supports TDP 165W at ambient 35°C
Supports TDP 205W at ambient 30°C
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Note: This device does not support Intel Omni-Path function.
Socket
Per Node:
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
Chipset
Intel® C621 Chipset
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_(G1, J1)
Note:
1. 2933MT/s for 2nd Generation Intel® Xeon® Scalable Processors only.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_(G1, J1)
Note:
1. 2933MT/s for 2nd Generation Intel® Xeon® Scalable Processors only.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
LAN
Per node:
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x 10/100/1000 Mbps CMC port
Note: Please contact FAE if NCSI function of OCP mezzanine card is needed.
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x 10/100/1000 Mbps CMC port
Note: Please contact FAE if NCSI function of OCP mezzanine card is needed.
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
6 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
6 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
RAID
For SATA drives:
Intel® SATA RAID 0/1/10/5
For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0/1/10/5
Note:
1) VROC module is compatible for Intel® SSD only.
2) Default 1 PCS VROC module for one 2U 4-Node server system.
Intel® SATA RAID 0/1/10/5
For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0/1/10/5
Note:
1) VROC module is compatible for Intel® SSD only.
2) Default 1 PCS VROC module for one 2U 4-Node server system.
Expansion Slots
Per node:
Riser Card CRSH010:
- 1 x PCIe x16 (Gen3 x16) low-profile slot, from CPU_0
Riser Card CRSH011:
- 1 x PCIe x8 (Gen3 x8) low-profile slot, from CPU_0
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0
Total:
Riser Card CRSH010 x 4:
- 4 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0
Riser Card CRSH011 x 4:
- 4 x PCIe x8 (Gen3 x8) low-profile slots, from CPU_0
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0
Riser Card CRSH010:
- 1 x PCIe x16 (Gen3 x16) low-profile slot, from CPU_0
Riser Card CRSH011:
- 1 x PCIe x8 (Gen3 x8) low-profile slot, from CPU_0
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0
Total:
Riser Card CRSH010 x 4:
- 4 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0
Riser Card CRSH011 x 4:
- 4 x PCIe x8 (Gen3 x8) low-profile slots, from CPU_0
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0
Internal I/O
Per node:
1 x COM header
2 x SATA 7-pin connectors
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
1 x COM header
2 x SATA 7-pin connectors
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system.
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.0
1 x VGA
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4
PCIe Gen3 x4
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Optional TPM2.0 kit: CTM000
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note: The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2500 management controller
AMI MegaRAC SP-X Solution Web interface
AMI MegaRAC SP-X Solution Web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
For Skylake processors:
Windows Server 2012 R2 Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
For Cascade Lake processors:
Windows Server 2012 R2 Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
. Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Windows Server 2012 R2 Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
For Cascade Lake processors:
Windows Server 2012 R2 Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
. Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 27.3 kg
Gross Weight: 45.92 kg
Gross Weight: 45.92 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H261-NO0
8 x CPU heatsinks
1 x Rail kit
1 x VROC module
8 x Non-Fabric CPU carriers
8 x CPU heatsinks
1 x Rail kit
1 x VROC module
8 x Non-Fabric CPU carriers
Part Numbers
- Barebone package: 6NH261NO0MR-00-1*
- Motherboard: 9MH61HD6NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 extension card: 9CMTP01LNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- Motherboard: 9MH61HD6NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 extension card: 9CMTP01LNR-00
- Ring topology kit: 6NH262Z65SR-00-100
* Veškeré zde uvedené materiály jsou pouze orientační. GIGABYTE si vyhrazuje právo kdykoliv měnit nebo revidovat obsah a to bez předchozího upozornění.
* Zmiňovaný výkon je založený na maximálních teoretických hodnotách z rozhraní jednotlivých čipsetů dodavatelů nebo organizace, která definovala specifikaci jednotlivých rozhraní. Skutečný výkon se může lišit v závislosti na konfiguraci systému.
* Všechny ochranné známky a loga jsou vlastnictvím jejich příslušných vlastníků.
* Díky standardní architektuře PC je určité množství paměti vyhrazeno pro systém, proto může být skutečná velikost dostupné paměti nižší než uvedené množství.
* Zmiňovaný výkon je založený na maximálních teoretických hodnotách z rozhraní jednotlivých čipsetů dodavatelů nebo organizace, která definovala specifikaci jednotlivých rozhraní. Skutečný výkon se může lišit v závislosti na konfiguraci systému.
* Všechny ochranné známky a loga jsou vlastnictvím jejich příslušných vlastníků.
* Díky standardní architektuře PC je určité množství paměti vyhrazeno pro systém, proto může být skutečná velikost dostupné paměti nižší než uvedené množství.
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Intel® Chipset Driver
Version : 10.1.17861.8101
3.34 MB
Apr 18, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Chipset Driver
Version : 10.1.18228.8176
3.12 MB
Dec 29, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
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Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
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BIOS
Popis
Verze
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Datum
Update for security: Vulnerabilities in EDK2 NetworkPkg include CVE-2023-45236, CVE- 2023-45237.
Version : R21
18.87 MB
May 27, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
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GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
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BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
English
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
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