SDM-1115G4L

Intel® Smart Display Module with Intel® 11th Generation Core™ i3-1115G4 Processor

Intel® Core™ i3-1115G4 Processor

Dual Channel DDR4, 2 x SO-DIMMs

1 x GbE LAN Port

3 x USB 3.2 Gen 1

1 x USB 2.0

Environment : Operation 0~55°C

Long life time support

Support 4K/60Hz, HDCP v2.2

(For more product information, please contact us at sales@gigaipc.com)

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11th Generation Intel® Core™ Processors

Intel's blazing fast, feature packed processor family with built-in security is ready to take your productivity, and creativity to the next level. And, by enabling new exciting Windows 10 features, the 11th generation Intel Core processors empower you to unleash your imagination and explore the possibilities.
HDMI™-The Next Generation Multimedia Interface

HDMI™ is a High-Definition Multimedia Interface which provides up to 5Gb/s video transmitting bandwidth and 8-channel high quality audio all through a single cable. Able to transmit superior, uncompressed digital video and audio, HDMI™ ensures the crispest rendering of digital content up to 1080p without the quality losses associated with analog interfaces and their digital-to-analog conversion. In addition, HDMI™ is compatible with HDCP (High-bandwidth Digital Content Protection), allowing the playback of Blu-ray/HD DVD and other protected media content.
SuperSpeed USB 3.0

With superfast transfer rates of up to 5 Gbps, users are able to experience a theoretical 10x improvement over USB 2.0. Additionally, backwards compatibility with USB 2.0 assures users of long term use of their legacy USB 2.0 devices.
M.2 Onboard Connector

Providing users PCI-Express connectivity for SSD devices. Delivering up to 10 Gbps data transfer speeds, M.2 offers users considerably faster storage performance than current mSATA and even SATA Revision 3 6Gbps storage devices.

* Veškeré zde uvedené materiály jsou pouze orientační. GIGABYTE si vyhrazuje právo kdykoliv měnit nebo revidovat obsah a to bez předchozího upozornění.
* Zmiňovaný výkon je založený na maximálních teoretických hodnotách z rozhraní jednotlivých čipsetů dodavatelů nebo organizace, která definovala specifikaci jednotlivých rozhraní. Skutečný výkon se může lišit v závislosti na konfiguraci systému.
* Všechny ochranné známky a loga jsou vlastnictvím jejich příslušných vlastníků.
* Díky standardní architektuře PC je určité množství paměti vyhrazeno pro systém, proto může být skutečná velikost dostupné paměti nižší než uvedené množství.

SPECIFICATIONS

Form Factor

SDM-Large
175W x 100D(mm)

Operating Properties

Operating temperature: 0°C to 55°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)

CPU

Intel® Core™ i3-1115G4 Processor
10nm SuperFin, 2 cores, 4 threads, up to 4.10 GHz
TDP 28W

Socket

1 x FCBGA1449

Memory

2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual Channel DDR4 3200 MHz memory modules

LAN

1 x GbE LAN Port (Intel® I219V)

Video

Integrated Graphics Processor - Intel® UHD Graphics:
1 x HDMI 2.0 (SDM), supporting a maximum resolution of 4096x2160 @60Hz
1 x Display Port (SDM), supporting a maximum resolution of 4096x2160 @60Hz
2 x HDMI 2.0 (Rear), supporting a maximum resolution of 4096x2160 @60Hz

(4 independent display outputs)

Audio

Intel® Integrated Audio

Expansion Slots

1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s)
1 x 2230 M.2 E-Key

Rear I/O

2 x HDMI
1 x RJ45 LAN Port
3 x USB 3.2 Gen 1
1 x USB 2.0
1 x PWR LED
1 x HDD LED
2 x External Antenna Holes (Optional)
1 x Reset button
1 x Power button

TPM

1 x TPM header

OS Supported

Windows® 10 (x64)

Packaging Content

Carton size: 465 x 351 x 217 (mm)
Packing Capacity: 10pcs

Including:
Screw Kit with #0 ZIPLOCK BAG SCREW-BIND M3.0*L5.0 NI x 2pcs (P/N: 25KSD-130053-S0R)

Ordering Information

9MTGU3ALMR-SI (Box packing)