H223-V10-AAW1

HPC/AI Arm Server - NVIDIA GH200 Grace Hopper Superchip - 2U 2-Node 8-Bay Gen5 NVMe
  • CPU+GPU design for giant-scale AI and HPC
  • 2U 2-node rear access server system
  • NVIDIA GH200 Grace Hopper Superchip
  • 900GB/s NVIDIA® NVLink®-C2C Interconnect
  • Up to 480GB CPU LPDDR5X ECC memory per module
  • Up to 96GB GPU HBM3 per module
  • Compatible with NVIDIA BlueField®-3 DPUs
  • 4 x 10Gb/s LAN ports via Intel® X550-AT2
  • 1 x CMC port
  • 8 x 2.5" Gen5 NVMe hot-swap bays
  • 4 x M.2 slots with PCIe Gen5 x4 interface
  • 2 x FHHL Dual slot PCIe Gen5 x16 slots
  • 2 x FHHL Single slot PCIe Gen5 x16 slots
  • 2 x OCP NIC 3.0 Gen5 x16 slots
  • 2+1 3000W 80 PLUS Titanium redundant power supplies
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* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 2-Node - Rear access
440 x 87.5 x 850
Motherboard
MV13-HD0
Superchip
Per node:
NVIDIA GH200 Grace Hopper Superchip:
- 1 x NVIDIA Grace™ CPU
- 1 x NVIDIA Hopper™ GPU
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 1000W (CPU + GPU + memory)
Memory
Per node:
NVIDIA Grace CPU:
- Up to 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s

NVIDIA Hopper GPU:
- Up to 96GB HBM3
- Memory bandwidth up to 4TB/s
LAN
Rear:
4 x 10Gb/s LAN (2 x Intel® X550-AT2)
- Support NCSI function

2 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN
Video
Integrated in Aspeed® AST2600 x 2
- 2 x Mini-DP
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe

Internal M.2:
4 x M.2 (2280/22110), PCIe Gen5 x4, from PEX89048
SAS
N/A
RAID
N/A
PCIe Expansion Slots
PCIe Cable x 4:
- 2 x FHHL x16 (Gen5 x16), Dual slot [1]
- 2 x FHHL x16 (Gen5 x16), Single slot

2 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function

[1] When BlueField-3 DPUs are installed, the ambient temperature is limited to 25℃.
Front I/O
2 x Power buttons with LED
2 x ID buttons with LED
2 x Reset buttons
2 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
4 x USB 3.2 Gen1 ports (Type-A)
2 x Mini-DP
4 x RJ45 ports
2 x MLAN ports
2 x ID LEDs
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies [1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1180 x 706 x 306 mm
Packaging Content
1 x H223-V10-AAW1
4 x Superchip heatsinks
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NH223V10MR000AAW1*
- Motherboard: 9MV13HD0NR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- Superchip heatsink: 25ST1-2532Z3-A0R
- Superchip heatsink: 25ST1-2532Z5-A0R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-888020-S1R
- M.2 riser card - CMTP0A2: 9CMTP0A2NR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000L-L0S

Optional parts:

- RMA packaging: 6NH223V10SR-RMA-A100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

SUPPORT

Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.

What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.

Firmware
Description
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