Dimensions (WxHxD, mm)
2U 2-Node - Rear access
440 x 87.5 x 850
Superchip
Per node:
NVIDIA GH200 Grace Hopper Superchip:
- 1 x NVIDIA Grace™ CPU
- 1 x NVIDIA Hopper™ GPU
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 1000W (CPU + GPU + memory)
Memory
Per node:
NVIDIA Grace CPU:
- Up to 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s
NVIDIA Hopper GPU:
- Up to 96GB HBM3
- Memory bandwidth up to 4TB/s
LAN
Rear:
4 x 10Gb/s LAN (2 x Intel® X550-AT2)
- Support NCSI function
2 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN
Video
Integrated in Aspeed® AST2600 x 2
- 2 x Mini-DP
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
Internal M.2:
4 x M.2 (2280/22110), PCIe Gen5 x4, from PEX89048
PCIe Expansion Slots
PCIe Cable x 4:
- 2 x FHHL x16 (Gen5 x16), Dual slot [1]
- 2 x FHHL x16 (Gen5 x16), Single slot
2 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function
[1] When BlueField-3 DPUs are installed, the ambient temperature is limited to 25℃.
Front I/O
2 x Power buttons with LED
2 x ID buttons with LED
2 x Reset buttons
2 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
4 x USB 3.2 Gen1 ports (Type-A)
2 x Mini-DP
4 x RJ45 ports
2 x MLAN ports
2 x ID LEDs
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM012
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed
® AST2600 Baseboard Management Controller
Aspeed
® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1180 x 706 x 306 mm
Packaging Content
1 x H223-V10-AAW1
4 x Superchip heatsinks
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NH223V10MR000AAW1*
- Motherboard: 9MV13HD0NR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- Superchip heatsink: 25ST1-2532Z3-A0R
- Superchip heatsink: 25ST1-2532Z5-A0R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-888020-S1R
- M.2 riser card - CMTP0A2: 9CMTP0A2NR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000L-L0S
Optional parts:
- RMA packaging: 6NH223V10SR-RMA-A100
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.