H223-S10-AAP1

High Density Server - 5th/4th Gen Intel^® Xeon^® Scalable - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe

# HPC # HCI # Edge # Hybrid/Private Cloud Server

2U 3-node front access server system
Single 5th/4th Gen Intel^® Xeon^® Scalable Processors per node
Single Intel^® Xeon^® CPU Max Series per node
8-Channel DDR5 RDIMM, 24 x DIMMs
Dual ROM Architecture
2 x CMC ports
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
3 x M.2 slots with SATA interface
6 x FHHL PCIe Gen5 x16 slots
3 x LP PCIe Gen5 x16 slots
3 x LP PCIe Gen5 x8 slots
1+1 3000W 80 PLUS Titanium redundant power supplies

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* Todos os materiais disponíveis são para simples referência. A GIGABYTE reserva o direito de modificar ou revisar o conteúdo a qualquer momento sem aviso prévio.
* Todas as marcas e logotipos são de propriedade de suas respectivas proprietárias.
* Devido a arquitetura padrão PC, uma quantia de memória é reservada para uso do sistema, portanto o tamanho da memória é menor do que a quantia exibida.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 3-Node - Front access
447.8 x 87.5 x 500

Motherboard

MS13-HD0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series
Single processor per node

TDP up to 350W at ambient 35°C with 1 x PCIe slot occupied
TDP up to 350W at ambient 30°C with 2 x PCIe slots occupied
TDP up to 300W at ambient 35°C with 3 x PCIe slots occupied
TDP up to 300W at ambient 30°C with 4 x PCIe slots occupied

Please contact technical support for more details.

Socket

Per Node:
1 x LGA 4677

Total:
3 x LGA 4677

Socket E

Chipset

Intel^® C741

Memory

Per node:
8 x DIMM slots

Total:
24 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel^® Xeon^®: Up to 5600 MT/s
4th Gen Intel^® Xeon^®: Up to 4800 MT/s
Intel^® Xeon^® Max Series: Up to 4800 MT/s

LAN

Total:
2 x CMC ports

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Total:
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

SAS

N/A

RAID

N/A

Expansion Slots

Per node:
Riser Card CRSH02D:
- 2 x PCIe x16 (Gen5 x16) FHHL slots

Riser Card CRSH02E:
- 1 x PCIe x16 (Gen5 x16) low-profile slot
- 1 x PCIe x16 (Gen5 x8) low-profile slot

1 x M.2 slot (CFPH010):
- M-key
- SATA, from PCH
- Supports 2242/2260/2280/22110 cards

Total:
Riser Card CRSH02D x 3:
- 6 x PCIe x16 (Gen5 x16) FHHL slots

Riser Card CRSH02E x 3:
- 3 x PCIe x16 (Gen5 x16) low-profile slots
- 3 x PCIe x16 (Gen5 x8) low-profile slots

3 x M.2 slots (CFPH010):
- M-key
- SATA, from PCH
- Support 2242/2260/2280/22110 cards

Internal I/O

Per node:
1 x TPM header
1 x VROC connector

Front I/O

Per node:
1 x USB 3.2 Gen1 (Type-C)
1 x Mini-DP
1 x Power button with LED
1 x System status LED
1 x ID LED

Total:
3 x USB 3.2 Gen1 (Type-C)
3 x Mini-DP
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED

Rear I/O

N/A

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

1+1 3000W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

Note: The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 17.2 kg
Gross Weight: 29 kg

Packaging Dimensions

857 x 670 x 280 mm

Packaging Content

1 x H223-S10-AAP1
3 x CPU heatsinks
1 x Mini-DP to D-Sub cable
9 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone package (5th/4th Gen): 6NH223S10DR000ABP1*
- Barebone package (4th Gen): 6NH223S10DR000AAP1*
- Motherboard: 9MS13HD0UR-000
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-453207-C1R
- Front panel board - CFPH030: 9CFPH030NR-00
- Backplane board - CBP2060: 9CBP2060NR-00
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH02D: 9CRSH02DNR-00
- Riser card - CRSH02E: 9CRSH02ENR-00
- EDSFF riser card - CSPP010: 9CSPP010NR-00
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00
- LAN bridge board - CLSH13: 9CLSH13NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000F-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH223S10SR-RMA-A100

SUPPORT

Downloads

Driver
BIOS
Utilidade
Firmware

Manual
Lista de Suporte

Online Support

Driver

BIOS

Utilidade

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Versão

Tamanho

Data

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

H223-S10-AAP1

SPECIFICATIONS

SUPPORT

RESOURCES

H223-S10-AAP1