- Home
- Enterprise
- GPU Servers
- G293-S45-IAP1
G293-S45- IAP1
HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 2U DP 8 x PCIe Gen5 GPUs Immersion
- Immersion Cooling Server
- Supports up to 8 x Dual slot Gen5 GPUs
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors
- Dual Intel® Xeon® CPU Max Series
- 8-Channel DDR5 RDIMM, 16 x DIMMs
- Dual ROM Architecture
- 2 x 10Gb/s LAN ports via Broadcom® BCM57416
- 8 x 2.5" SATA/SAS hot-swap bays
- 8 x FHFL PCIe Gen5 x16 slots for GPUs
- 2 x LP PCIe Gen5 x16 slots
- Dual 3000W 80 PLUS Titanium redundant power supply
* Todos os materiais disponíveis são para simples referência. A GIGABYTE reserva o direito de modificar ou revisar o conteúdo a qualquer momento sem aviso prévio.
* Todas as marcas e logotipos são de propriedade de suas respectivas proprietárias.
* Devido a arquitetura padrão PC, uma quantia de memória é reservada para uso do sistema, portanto o tamanho da memória é menor do que a quantia exibida.
* Todas as marcas e logotipos são de propriedade de suas respectivas proprietárias.
* Devido a arquitetura padrão PC, uma quantia de memória é reservada para uso do sistema, portanto o tamanho da memória é menor do que a quantia exibida.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
448 x 87.5 x 800
448 x 87.5 x 800
Motherboard
MS43-G21
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Socket E
Chipset
Intel® C741
Memory
16 x DIMM slots
DDR5 memory supported
8-Channel memory architecture
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s
DDR5 memory supported
8-Channel memory architecture
5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s
4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s
Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s
LAN
Top:
2 x 10Gb/s LAN (1 x Broadcom® BCM57416)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
2 x 10Gb/s LAN (1 x Broadcom® BCM57416)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
- 1 x VGA port
- 1 x VGA port
Storage
Bottom hot-swap:
8 x 2.5" Gen4 NVMe/SATA/SAS [1][2]
[1] SAS card is required to support SAS drives.
[2] NVMe support requires additional NVMe cables and occupies PCIe slots. Please refer to optional parts for qualified NVMe cables.
8 x 2.5" Gen4 NVMe/SATA/SAS [1][2]
[1] SAS card is required to support SAS drives.
[2] NVMe support requires additional NVMe cables and occupies PCIe slots. Please refer to optional parts for qualified NVMe cables.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Onboard VROC key header
Support optional RAID add-in cards
Onboard VROC key header
Support optional RAID add-in cards
PCIe Expansion Slots
Riser Card CRSG229 x 2:
- 2 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs
- 2 x FHFL x16 (Gen5 x16), from CPU_1, for GPUs
Riser Card CRSG22A x 2:
- 2 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs
- 2 x FHFL x16 (Gen5 x16), from CPU_1, for GPUs
Riser Card CRSG01F x 2:
- 1 x LP x16 (Gen5 x16), from CPU_0
- 1 x LP x16 (Gen5 x16), from CPU_1
[Note] Maximum GPU dimensions (LxWxH): 285 x 111.5 x 39.5mm.
[Note] The system is only validated with a uniform GPU model.
- 2 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs
- 2 x FHFL x16 (Gen5 x16), from CPU_1, for GPUs
Riser Card CRSG22A x 2:
- 2 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs
- 2 x FHFL x16 (Gen5 x16), from CPU_1, for GPUs
Riser Card CRSG01F x 2:
- 1 x LP x16 (Gen5 x16), from CPU_0
- 1 x LP x16 (Gen5 x16), from CPU_1
[Note] Maximum GPU dimensions (LxWxH): 285 x 111.5 x 39.5mm.
[Note] The system is only validated with a uniform GPU model.
Top I/O
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
1 x VGA port
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply [1]
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022
Additional certifications:
Windows Server 2022
Operating Properties
Operating coolant temperature: 25°C to 35°C
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 34.86 kg
Gross Weight: 36.86 kg
Gross Weight: 36.86 kg
Packaging Dimensions
1133 x 724 x 261 mm
Packaging Content
1 x G293-S45-IAP1
2 x CPU heatsinks
4 x GPU power cables (12VHPWR, 250mm)
4 x GPU power cables (12VHPWR, 280mm)
6 x Carriers
2 x CPU heatsinks
4 x GPU power cables (12VHPWR, 250mm)
4 x GPU power cables (12VHPWR, 280mm)
6 x Carriers
Part Numbers
- Barebone package (5th/4th Gen): 6NG293S45DR000IBP1*
- Barebone package (4th Gen): 6NG293S45DR000IAP1*
- Motherboard: 9MS43G21UR-000*
- CPU heatsink: 25ST1-25320R-C1R/25ST1-25320S-C1R
- Backplane board - CBPG086: 9CBPG086NR-00*
- Riser card - CRSG01F: 9CRSG01FNR-00*
- Riser card - CRSG229: 9CRSG229NR-00*
- Riser card - CRSG22A: 9CRSG22ANR-00*
- GPU power cable (12VHPWR, 250mm): 25CRI-250107-Y4R
- GPU power cable (12VHPWR, 280mm): 25CRI-300102-Y4R
- Power supply: 25EP0-23000E-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- NVMe cable (MCIO 8i to 2 x MCIO 4i): 25CF9-350705-A4R
- NVMe cable (MCIO 4i to MCIO 4i): 25CF9-700050-A4R
- RMA packaging: 6NG293S45SR-RMA-I100
- Barebone package (4th Gen): 6NG293S45DR000IAP1*
- Motherboard: 9MS43G21UR-000*
- CPU heatsink: 25ST1-25320R-C1R/25ST1-25320S-C1R
- Backplane board - CBPG086: 9CBPG086NR-00*
- Riser card - CRSG01F: 9CRSG01FNR-00*
- Riser card - CRSG229: 9CRSG229NR-00*
- Riser card - CRSG22A: 9CRSG22ANR-00*
- GPU power cable (12VHPWR, 250mm): 25CRI-250107-Y4R
- GPU power cable (12VHPWR, 280mm): 25CRI-300102-Y4R
- Power supply: 25EP0-23000E-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- NVMe cable (MCIO 8i to 2 x MCIO 4i): 25CF9-350705-A4R
- NVMe cable (MCIO 4i to MCIO 4i): 25CF9-700050-A4R
- RMA packaging: 6NG293S45SR-RMA-I100
* Todos os materiais disponíveis são para simples referência. A GIGABYTE reserva o direito de modificar ou revisar o conteúdo a qualquer momento sem aviso prévio.
* Todas as marcas e logotipos são de propriedade de suas respectivas proprietárias.
* Devido a arquitetura padrão PC, uma quantia de memória é reservada para uso do sistema, portanto o tamanho da memória é menor do que a quantia exibida
* Todas as marcas e logotipos são de propriedade de suas respectivas proprietárias.
* Devido a arquitetura padrão PC, uma quantia de memória é reservada para uso do sistema, portanto o tamanho da memória é menor do que a quantia exibida
SUPPORT
Driver
BIOS
Utilidade
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
Chipset
Chipset
Versão
Tamanho
Data
Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
Sistema Operacional: Windows Server 2019,Windows Server 2022
LAN
LAN
Versão
Tamanho
Data
Broadcom® BCM57416 LAN Card Driver
Version : 1.0
0.65 MB
Nov 11, 2022
Sistema Operacional: Windows Server 2019,Windows Server 2022
RAID
RAID
Versão
Tamanho
Data
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 8.5.0.1593
99.21 MB
Jan 04, 2024
Sistema Operacional: Windows Server 2019,Windows Server 2022
Utility
BIOS
Descrição
Versão
Tamanho
Data
Include AMI SA50248 (CWE-119), and multiple feature updates.
Version : R07
29.26 MB
May 15, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Aviso:
Por haver pontencial de risco na atualização do BIOS, se não houver problemas com a BIOS atual, é recomendado não atualizá-la. Para atualizar, execute com cuidado. Atualização incorreta da BIOS pode tornar o sistema inoperante.
O que é BETA?
BETA descreve uma nova versão que é estável, mas pode não incluir todos recursos do produto final. Durante esta fase executamos testes dos novos recursos e recolhemos informações de usuários para certificarmos que nossos produtos forneçam o melhor desempenho possível.
Por haver pontencial de risco na atualização do BIOS, se não houver problemas com a BIOS atual, é recomendado não atualizá-la. Para atualizar, execute com cuidado. Atualização incorreta da BIOS pode tornar o sistema inoperante.
O que é BETA?
BETA descreve uma nova versão que é estável, mas pode não incluir todos recursos do produto final. Durante esta fase executamos testes dos novos recursos e recolhemos informações de usuários para certificarmos que nossos produtos forneçam o melhor desempenho possível.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Utilidade
Descrição
Versão
Tamanho
Data
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
Sistema Operacional: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
Sistema Operacional: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
Sistema Operacional: Linux,Windows Server 2016 64bit,Windows Server 2019
BMC Restore Default Setting utility
Version : 1.0
0.15 MB
Mar 17, 2020
Sistema Operacional: Ubuntu
Manual
Descrição
Versão
Tamanho
Data
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
Inglês
Descrição
Versão
Tamanho
Data
Lista de Suporte de Sistema Operacional
Version : R12
0.22 MB
Jul 15, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
RESOURCES
Articles
Tech Guide | August 01, 2024
How to Get Your Data Center Ready for AI? Part One: Advanced Cooling
The proliferation of artificial intelligence has led to the broader adoption of innovative technology, such as advanced cooling and cluster computing, in data centers around the world. Specifically, the rollout of powerful AI processors with ever higher TDPs has made it all but mandatory for data centers to upgrade or even retrofit their infrastructure to utilize more energy-efficient and cost-effective cooling. In part one of GIGABYTE Technology’s latest Tech Guide, we explore the industry’s most advanced cooling solutions so you can evaluate whether your data center can leverage them to get ready for the era of AI.
News
Others
Back to G293-S45-IAP1