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H263-S63- AAW1
High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 3000W
- 2U 4-node rear access server system
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
- 8-Channel DDR5 RDIMM, 64 x DIMMs
- Dual ROM Architecture
- 1 x CMC port
- 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
- 8 x LP PCIe Gen5 x16 slots
- 4 x LP PCIe Gen5 x16 slots (optional)
- 4 x OCP 3.0 Gen5 x16 slots
- Dual 3000W 80 PLUS Titanium redundant power supply
* Das vorliegende Material dient nur zur Referenz. GIGABYTE behalt sich das Recht vor, ohne Vorwarnung Inhalte zu verandern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers fur die Nutzung des Systems reserviert und daher kann die aktuelle Speichergrose von der Speicherangabe abweichen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers fur die Nutzung des Systems reserviert und daher kann die aktuelle Speichergrose von der Speicherangabe abweichen.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MS63-HD1
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 225W
Supports TDP up to 270W with only 1 x low-profile slot being used and no support on OCP slot at ambient 30°C.
Supports TDP up to 270W with 2 x low-profile slots being used and no support on OCP slot at ambient 25°C.
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 225W
Supports TDP up to 270W with only 1 x low-profile slot being used and no support on OCP slot at ambient 30°C.
Supports TDP up to 270W with 2 x low-profile slots being used and no support on OCP slot at ambient 25°C.
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
Per Node:
2 x LGA 4677
Total:
8 x LGA 4677
Socket E
2 x LGA 4677
Total:
8 x LGA 4677
Socket E
Chipset
Intel® C741
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
16 x DIMM slots
Total:
64 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
LAN
Per node:
1 x 10/100/1000 Mbps Management LAN
Total:
4 x 10/100/1000 Mbps Management LAN
*1 x CMC port
*Please refer to optional parts for ring topology support.
Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
1 x 10/100/1000 Mbps Management LAN
Total:
4 x 10/100/1000 Mbps Management LAN
*1 x CMC port
*Please refer to optional parts for ring topology support.
Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
SAS card is required for SAS devices support
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1
Expansion Slots
Per node:
Riser Card CRSH01T:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
Riser Card CRSH310 (optional):
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
Optional 1 x M.2 slot (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards
Total:
Riser Card CRSH01T x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
Riser Card CRSH310 x 4 (optional):
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
Optional 4 x M.2 slots (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2280/22110 cards
Riser Card CRSH01T:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
Riser Card CRSH310 (optional):
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
Optional 1 x M.2 slot (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards
Total:
Riser Card CRSH01T x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
Riser Card CRSH310 x 4 (optional):
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
Optional 4 x M.2 slots (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2280/22110 cards
Internal I/O
Per node:
1 x TPM header
1 x VROC connector
1 x TPM header
1 x VROC connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system.
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system.
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
Note: The system power supply requires C19 power cord.
Available for 2+1 redundant power supply configuration (optional)
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022 (x64)
Additional certifications:
Windows Server 2022 (x64)
System Fans
8 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 47.68 kg
Gross Weight: 62.4 kg
Gross Weight: 62.4 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H263-S63-AAW1
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit
8 x CPU heatsinks
24 x Carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone package (5th/4th Gen): 6NH263S63DR000ABW1*
- Barebone package (4th Gen): 6NH263S63DR000AAW1*
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453207-C1R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-88382P-S1R/25ST2-88382Q-S1R
- Riser card - CRSH01T: 9CRSH01TNR-00
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power supply: 25EP0-23000L-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Riser card - CRSH310: 9CRSH310NR-00
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S63SR-RMA-A100
- Barebone package (4th Gen): 6NH263S63DR000AAW1*
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453207-C1R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-88382P-S1R/25ST2-88382Q-S1R
- Riser card - CRSH01T: 9CRSH01TNR-00
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power supply: 25EP0-23000L-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Riser card - CRSH310: 9CRSH310NR-00
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- RMA packaging: 6NH263S63SR-RMA-A100
* Das vorliegende Material dient nur zur Referenz. GIGABYTE behält sich das Recht vor, ohne Vorwarnung Inhalte zu verändern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers für die Nutzung des Systems reserviert und daher kann die aktuelle Speichergröße von der Speicherangabe abweichen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers für die Nutzung des Systems reserviert und daher kann die aktuelle Speichergröße von der Speicherangabe abweichen.
SUPPORT
Treiber
BIOS
Utility
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
Chipset
Chipset
Version
Größe
Datum
Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
Betriebssystem: Windows Server 2019,Windows Server 2022
RAID
RAID
Version
Größe
Datum
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 8.5.0.1593
99.21 MB
Jan 04, 2024
Betriebssystem: Windows Server 2019,Windows Server 2022
Utility
BIOS
Beschreibung
Version
Größe
Datum
Include AMI SA50248 (CWE-119), and multiple feature updates.
Version : R07
29.22 MB
May 15, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warnung:
Das das Flashen des BIOS ein potentielles Risiko für den PC darstellt, empfehlen wir, das BIOS nicht zu flashen wenn der PC problemlos arbeitet. Seien Sie beim Flashen bitte vorsichtig. Ein unpassendes BIOS kann zu Systemfehlern führen.
Was ist eine BETA-Version?
BETA steht für eine neue Version, die noch in der Entwicklungsphase ist und nicht alle Funktionen der finalen Version beinhaltet. Während der Entwicklungsphase stellen wir den Usern und Kunden Vorschau-Versionen zur Verfügung, die neueste Funktionen enthalten, um die Produkte noch weiter zu verbessern..
Das das Flashen des BIOS ein potentielles Risiko für den PC darstellt, empfehlen wir, das BIOS nicht zu flashen wenn der PC problemlos arbeitet. Seien Sie beim Flashen bitte vorsichtig. Ein unpassendes BIOS kann zu Systemfehlern führen.
Was ist eine BETA-Version?
BETA steht für eine neue Version, die noch in der Entwicklungsphase ist und nicht alle Funktionen der finalen Version beinhaltet. Während der Entwicklungsphase stellen wir den Usern und Kunden Vorschau-Versionen zur Verfügung, die neueste Funktionen enthalten, um die Produkte noch weiter zu verbessern..
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Utility
Beschreibung
Version
Größe
Datum
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
Betriebssystem: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
Betriebssystem: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
Betriebssystem: Linux,Windows Server 2016 64bit,Windows Server 2019
BMC Restore Default Setting utility
Version : 1.0
0.15 MB
Mar 17, 2020
Betriebssystem: Ubuntu
Firmware
Beschreibung
Version
Größe
Datum
BMC firmware with embedded GIGABYTE Management Console (AST2600)
Version : 13.06.09
123.77 MB
Sep 05, 2024
English
GIGABYTE Management Console Web GUI Tool
GCT Diagnostic Analyzer
GCT Diagnostic Analyzer
Version : 1.0
2519.27 MB
Aug 15, 2024
English
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
English
Handbuch
Beschreibung
Version
Größe
Datum
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
English
Beschreibung
Version
Größe
Datum
BS-Kompatibilitätsliste
Version : R12
0.22 MB
Jul 15, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
RESOURCES
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