H253-Z10-AAP1

Rev. 3.x Rev. 1.x

High-Density Server - AMD EPYC™ 9005/9004 - 2U 4-Node UP 8-Bay E1.S Gen4 NVMe

# HPC # HCI

2U 4-node front access server system
Single AMD EPYC™ 9005/9004 Series Processors per node
12-Channel DDR5 RDIMM, 24 x DIMMs per node
Dual ROM Architecture
8 x 1Gb/s LAN ports via Intel^® I350-AM2
2 x CMC ports
8 x E1.S Gen4 NVMe hot-swap bays
12 x M.2 slots with PCIe Gen5 x4 and SATA interface
4 x LP PCIe Gen5 x16 slots
4 x OCP NIC 3.0 PCIe Gen5 x16 slots
Dual 3000W 80 PLUS Titanium redundant power supply

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* Das vorliegende Material dient nur zur Referenz. GIGABYTE behalt sich das Recht vor, ohne Vorwarnung Inhalte zu verandern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers fur die Nutzung des Systems reserviert und daher kann die aktuelle Speichergrose von der Speicherangabe abweichen.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Front access
447 x 86.8 x 902

Motherboard

MZ13-SH0

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Single processor per node, cTDP up to 300W^[1]
- At ambient 30°C, cTDP up to 400W^[1]

^[1]Please refer to the QVL on the support page or contact our sales representatives for verified CPU SKUs.

Socket

4 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

96 x DIMM slots
DDR5 memory supported
12-Channel memory per processor

AMD EPYC™ 9005:
RDIMM: Up to 5200 MT/s (1DPC)
RDIMM: Up to 4400 MT/s (1R 2DPC), 4000 MT/s (2R 2DPC)

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s (1DPC), 3600 MT/s (2DPC)

LAN

Front:
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN

Rear:
2 x CMC ports

^[Note]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x Mini-DP

Storage

Front hot-swap:
8 x 9.5mm E1.S Gen4 NVMe

Internal M.2:
4 x M.2 (2280/22110), PCIe Gen5 x4
8 x M.2 (2280), SATA via ASM1062R
- Support SATA Hardware RAID 0/1

SAS

N/A

RAID

N/A

PCIe Expansion Slots

Riser Card CRSH01Q x 4:
- 4 x LP x16 (Gen5 x16)

4 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function

Front I/O

8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs

Rear I/O

2 x CMC ports

Backplane Board

N/A

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply^[1]

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H253-Z10-AAP1
4 x CPU heatsinks
1 x Mini-DP to D-Sub cable
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NH253Z10DR000ACP1*
- Motherboard: 9MZ13SH0UR-000-3*
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-553202-A0R
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00*
- EDSFF riser card - CRSH01X: 9CRSH01XNR-00*
- CMC module - CMBH42: 9CMBH42NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000H-G1S

Optional parts:

- E1.S Latch with dummy tray (24 in 1): 6NH253Z10S1000AAP11
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH253Z10SR-RMA-A100

* Das vorliegende Material dient nur zur Referenz. GIGABYTE behält sich das Recht vor, ohne Vorwarnung Inhalte zu verändern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers für die Nutzung des Systems reserviert und daher kann die aktuelle Speichergröße von der Speicherangabe abweichen.

SUPPORT

Downloads

Treiber
BIOS
Utility
Firmware

Handbuch
Kompatibilitätsliste

Online Support

Treiber

BIOS

Utility

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Version

Größe

Datum

Chipset driver for AMD EPYC 9005/9004 series processors

Version : 6.10.07.747

2.82 MB

Oct 29, 2024

H253-Z10-AAP1

SPECIFICATIONS

SUPPORT

RESOURCES

H253-Z10-AAP1 (Rev. 3.x)