H374-A80-AAW1

High Density Server - Intel^® Xeon^® 6 Processors - 3U 4-Node DP 24-Bay Gen5 NVMe/SATA/SAS-4

# HPC # HCI # Hybrid/Private Cloud Server

3U 4-node rear access server system
Dual Intel^® Xeon^® 6 Processors per node, LGA 7529
12-Channel DDR5 RDIMM / MRDIMM, 24 x DIMMs per node
Dual ROM Architecture
8 x 1Gb/s LAN ports via Intel^® I350-AM2
24 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
16 x LP PCIe Gen5 x16 slots
Triple 3000W 80 PLUS Titanium redundant power supply

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مقارنة

* كل المعلومات المذكورة للاطلاع فقط. وتحتفظ جيجابايت بالحق في تعديلها أو مراجعتها في أي وقت دون اخطار مسبق.
* مستوى الأداء المعروض اعتماداً على أقصي القيم الافتراضية للواجهات والتي زودنا بها المصنعين المختلفين والذين وضعوا المعايير القياسية لهذه الواجهات. وقد يختلف مستوى الأداء الفعلي باختلاف مواصفات الحاسب.
* كل العلامات التجارية والشعارات هي ملك لحامليها.
* نظرأً لخصائص الحاسب القياسية، فإن قدراً من السعة الكلية للذاكرة يتم استخدامه من قبل الحاسب ولذلك تصبح سعة الذاكرة الحقيقية أقل من السعة المذكورة على وحدات الذاكرة.

SPECIFICATIONS

Dimensions (WxHxD, mm)

3U 4-Node - Rear access
447 x 130.8 x 895

Motherboard

MA84-HD0

CPU

Intel^® Xeon^® 6 Processors
- Intel^® Xeon^® 6900-Series Processors

Dual processor per node, TDP up to 400W
- With 2 x LP cards at 30°C ambient, TDP up to 500W
- With 4 x LP cards at 25°C ambient, TDP up to 500W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

8 x LGA 7529
Socket BR

Chipset

System on Chip

Memory

96 x DIMM slots
DDR5 memory supported
12-Channel memory per processor
MRDIMM supported^[1]
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s

^[1]MRDIMMs are only supported with Intel^® Xeon^® 6 Processors with P-cores.

LAN

Rear (I/O board - CLNP319 x 4):
8 x 1Gb/s LAN (4 x Intel^® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN^[1]

^[1]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x Mini-DP

Storage

Front hot-swap:
24 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from CPU_1)

^[1]Storage card is required to support SATA and SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards
Onboard VROC key header

PCIe Expansion Slots

PCIe Cable x 8:
- 8 x LP x16 (Gen5 x16), from CPU_1

Riser Card CRCH010 x 8:
- 8 x LP x16 (Gen5 x16), from CPU_0

Front I/O

4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button

Rear I/O

I/O board - CLNP319 x 4:
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x ID buttons with LED
4 x System status LEDs

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

4 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM012

4 x PRoT connectors (only enabled on RoT SKU)

Power Supply

Triple 3000W 80 PLUS Titanium redundant power supply^[1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2620 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 92x92x76mm

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1179 x 700 x 411 mm

Packaging Content

1 x H374-A80-AAW1
8 x CPU heatsinks
1 x Mini-DP to D-Sub cable
8 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NH374A80DR000AAW1*
- Motherboard: 9MA84HD0UR-000*
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-253210-C1R / 25ST1-253211-C1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH0O8: 9CBPH0O8NR-00*
- Fan module: 25ST2-997620-A0R
- Riser card - CRCH010: 9CRCH010NR-00*
- I/O board - CLNP319: 9CLNP319NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-230009-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R

SUPPORT

ملفات للتحميل

برامج تشغيل
BIOS
الأداة
Firmware

دليل المستخدم
قائمة الدعم

Online Support

برامج تشغيل

BIOS

الأداة

Firmware

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

النسخة

الحجم

التاريخ

Intel^® Chipset Driver

Version : 10.1.19975.8620

6.41 MB

Oct 08, 2024

H374-A80-AAW1

SPECIFICATIONS

SUPPORT

RESOURCES

H374-A80-AAW1