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Thermal Design
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  Thermal Design
 
GIGABYTE motherboards feature a high performance copper heat pipe with a sintered process to improve heat transfer between the heat source and the cooling fins of the heat sink. The heat sinks are designed for ultra efficient heat dissipation and are aided by the CPU fan blowing air down onto the CPU cooler.

* Only for GA-P67A-UD7-B3

  * GA-P67A-UD7-B3
 
 
 


 
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