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Leading the Motherboard Industry Inside and Out!
GIGABYTE Ultra Durable™ 3 + Smart 6™ Technology |
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GIGABYTE Ultra Durable™ 3 Technology
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GIGABYTE Ultra Durable™ 3 series motherboards once again lead the motherboard industry for the highest quality and most innovative motherboard design. Featuring the industry's first consumer desktop motherboard design to introduce 2 ounces of copper for both the Power and Ground layers, GIGABYTE Ultra Durable™ 3 motherboards deliver dramatically lower system temperature, improved energy efficiency and enhanced stability for overclocking. |
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50,000 hrs. Japanese Solid Capacitor |
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Lower RDS(on)
MOSFET |
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Signal Layer |
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Prepreg |
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Power /
Ground layer |
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Core |
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Ground layer
Prepreg
Signal Layer |
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CPU VRM Temperature measurements under system setup with water-cooler block and CPU running at 100% loading |
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| The benefits of 2 oz Copper PCB design |
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Lower
Temperature |
Better
Overclocking |
Better Power
Efficiency |
2X Lower
Impedance |
Lower EMI |
Better ESD
Protection |
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| Lower Temperature |
Doubling the amount of copper provides a more effective thermal cooling solution by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. In fact, GIGABYTE Ultra Durable™ 3 motherboards are able to deliver twice as cool working temperatures than traditional motherboards. |
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| Infra Red CPU VRM Thermal Diagram |
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| * CPU VRM Temperature measurements under CPU running at 100% loading. |
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| 2X Lower Impedance |
In addition, doubling the amount of copper lowers the PCB impedance by 50%. Impedance is a measure of how much the circuit impedes the flow of current. The less the flow of current is impeded, the less amount of energy is wasted. For GIGABYTE Ultra Durable™ 3 motherboards, this means total PCB electrical waste is reduced by 50%, which also means less heat is generated. 2 ounces of copper also provides improved signal quality, providing better system stability and allowing greater margins for overclocking. |
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Impedance Ω |
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Lower is better |
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Lower |
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Better Overclocking |
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Delivering native support for DDR3 2200+ and DDR2 memory up to 1366+ MHz, GIGABYTE Ultra Durable™ 3 series motherboards allow users to reach higher memory frequency at lower voltage; achieving higher memory performance with lower power consumption to run even the most memory intensive applications such as high-definition video and 3D games with ease. |
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| Lower EMI |
A good PCB circuit layout is the key of controlling EMI emission. GIGABYTE's Ultra Durable™ 3 design features 2 ounces of copper for ground layers, improves signal integrity and lowers EMI emissions through a very effective ground plane.
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| * Electromagnetic interference (or EMI) is an unwanted disturbance signals that affects surrounding electronic devices. |
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| Better Power Efficiency |
Increasing the thickness of the motherboard PCB Power layer by using 2 ounces of Copper allows the electric current to flow with less resistance, enabling more power efficient circuits with lower power loss and less heat generated. |
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| Better ESD Protection |
2 ounces of Copper for the Ground layer of the motherboard PCB allows for a more efficient Electro-Static Discharge (ESD) of up to 10%. This helps to better protect the motherboard components against damage caused by static electricity.
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